Die attach is a major and important step in the Assembly and Packaging process. The die attach material not only holds the die in place on the leadframe or substrate, but it also provides electrical connection to the leadframe or substrate, and can help dissipate heat into the leadframe or substrate. This course covers the important aspects of die attach, including the overall process, the materials, quality criteria, reliability issues, and measurement and inspection techniques.
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: electrical connections to the customer’s printed circuit board or module; protection from the environment; heat transfer; and providing a format for handling. Numerous critical technologies have been developed to create these packages; technologies that continue to advance with each new requirement for cost reduction, space savings, higher speed electrical performance, finer pitch, die surface fragility, new reliability requirements, and new applications. One of these technologies is die attach. Die Attach is an 8-hour course that covers the materials, processes, and process flows for attaching a semiconductor die to a substrate.
By focusing on current issues with die attach technology, participants will learn why advances in the industry are occurring along certain lines and not others. Participants will learn about this particular aspect of semiconductor packaging without having to delve heavily into the complex physics and materials science that normally accompany this discipline.