Wafer Dicing is an important part of the semiconductor manufacturing
process. After the wafer finishes processing, we need to separate or
singulate the die from each other. Engineers can use several different
methods to singulate the dice from the wafer: traditional saw blade
methods, laser dicing, plasma dicing, waterjet dicing, and other
variations. We will discuss these techniques in more detail in this
course, along with challenges associated with non-silicon semiconductor
wafers, such as GaAs.
Wafer Dicing is an important part of the semiconductor manufacturing
process. After the wafer finishes processing, we need to separate or
singulate the die from each other. Engineers can use several different
methods to singulate the dice from the wafer: traditional saw blade
methods, laser dicing, plasma dicing, waterjet dicing, and other
variations. We will discuss these techniques in more detail in this
course, along with challenges associated with non-silicon semiconductor
wafers, such as GaAs.